Update:

> The relevant ASIA PAC presentations are online:
> https://www.power.org/wp-content/uploads/2012/09/2.CCore_Mr._Jian_Zheng.pdf (translation)
> https://www.power.org/wp-content/uploads/2012/09/6.Chinachip_Mr._Walter_Li_upd.pdf (translation)
> https://www.power.org/wp-content/uploads/2012/09/9._VeriSilicon_Rui_Wang.pdf
>
> This is what I could take from them:
>
> C*Core: C8000 (0.8 to 1.2 GHz) and C9000 (1.2 to 1.5 GHz) chips based on PPC460
> or PPC476FP cores (roadmap depiction)
> Chinachip & VeriSilicon: CC2000 chip* based on PPC460 or PPC476FP cores with
> HD audio, 2D/3D GPU (OpenGL ES, OpenVG), DSP, USB, SATA2 etc.

From the ASIA PAC 2012 agenda:

C*Core:
"C*Core scalable design platform help you to win! - Introducing the C*Core scalable design platform based on PowerPC ISA"

VeriSilicon:
"PowerPC based SoC development platform running Android/Linux OS - This presentation outlines a high performance, scalable and re-usable SoC development platform for a variety of multi-media applications, such as gaming. Platform based SoC development reduces risk, time-to-market, and cost while provides flexibility to develop application specific features and functions."

From a current Power.org press release:

"[...] the availability of Android operating system (OS) 2.3 port as open source code for the embedded community [...] was made possible through collaborative effort between VeriSilicon and Mentor Graphics based on PowerPC 460. [...] "[...] This port was coordinated by VeriSilicon (Power.Org member) working with Mentor Graphics, and validated on VeriSilicon's PowerPC based, multi-core SoC development platform" said Elmer Corbin, chairman, board of directors, for Power.org. [...] Demonstration of Android 2.3 on a Power platform will occur at the 2012 ASIA Power Architecture Conference."

ASIA PAC 2012 presentation slides:
https://www.power.org/wp-content/uploads/2012/10/3.3-CCORE-ZhengJiang-2012-ASIA-PACfinal.pdf
https://www.power.org/wp-content/uploads/2012/10/4.-CCore-Scaleable-Design-Platform-JoeXiaofinal.pdf
https://www.power.org/wp-content/uploads/2012/10/5.-VeriSilicon-Open-Platform_English-Edition-Rui-1.5.pdf

Other presentation slides:
http://www.ipmall.org.cn/chinachip/ppt/CCore%20Scaleable%20Design%20Platform-%E4%B8%AD%E5%9B%BD%E8%8A%AF.pdf
http://www.ipmall.org.cn/chinachip/ppt/%E4%B8%AD%E5%9B%BD%E8%8A%AF-Miya.pdf (translation, page 32)
http://www.siridamedia.com/yth/20130912_OTT_KW.pdf (translation, page 48/49)
http://www.chinaicexpo.com/speech/3G/VeriSiliconMiya.pdf (page 24)
http://www.chinaicexpo.com/speech/PPT/XY.pdf (page 27)

Edit: added press release.
Edit2: added links to presentation slides

[ Edited by Andreas_Wolf 17.07.2014 - 18:18 ]