>Thanks for the comments. I wasn't aware of capillary forces being used for heatpipes too.

Examples can be found here.

>I'll use the RC5 client next time. I don't have it yet. Does it use Altivec?

It uses Altivec when available (not in current MOS revision). Afair it runs nicely out of cache and keeps the execution units busy. There are installation instructions available.

>The thermal resistance of the interface material between device and cooling solution is assumed to be about 1.5 K/W.
>So at the maximum rating of 22 Watts this results into a 22*(0.1+1.5)=35.2 Celsius temperature difference between
>the actual cooling solution and the junction.

Ok, if I read that paper right you could substantially reduce the thermal resistance between Die and cooler by choosing
some thermal paste. It was never applied for either G3 or G4 by bplan.

>Oh, before I forget: you don't need to buy an extra CPU thermometer. One is included inside the G4 (and G3) already.

The G3 one can be 15 degrees off or more I hear.
Don't know about the G4.